We’ve already tested Intel’s latest generation i7-11700K, and the results are as predictable as you can expect. Without further ado, let’s check out the video below! Please ‘like’ and subscribe to my channel, and don’t forget to click the ‘bell’ icon to get the latest video updates.

Asus has integrated AI2.0 technology into the Z590 series motherboards, namely AI Noise Cancelation, AI Overclocking, AI Cooling and AI Networking.

WiFi 6E availability and features are dependent on regulatory limitations and co-existence with 5 GHz WiFi.

AI Overclocking quickly and intelligently assesses the processor’s overclocking potential and system cooling conditions, and accurately predicts the overclocking voltage and frequency for performance tuning recommendations, quickly delivering the overclocking performance that experts would normally spend days manually adjusting to achieve, and easily getting higher performance. There are two ways to enable AI Overclocking: First is to use the ASUS AI Suite 3 in Windows. The second is to enable it from within the motherboard BIOS.

AI Cooling automatically controls the connected motherboard fans, adjusting the fan settings in real-time according to the system load and temperature to ensure that they are in the ideal state and effectively reduce fan noise.

AI Networking is designed to help gamers achieve a smooth, lag-free gaming experience. GameFirst VI Low Latency Technology uses AI-enhanced recognition and speed-boosting technology to ensure faster and smarter network optimisation.

AI Noise Cancelation intelligently reduces distracting keyboard noise, mouse clicks and other environmental noises, allowing gamers to hear and be heard clearly while gaming or on a call.

In addition, these motherboards include the Memtest86 program directly in the BIOS, a program that should be no stranger to overclockers. Memtest86 is a free and open-source memory testing software that is used to test the stability of memory and is a popular overclocking test tool among overclockers around the world. Of course, it is also one of the essential tools for computer repair departments around the world.

This time, the motherboard we got are the ROG Maximus XIII Hero(M13H), Z590-E Gaming WIFI and Z590-A Gaming WIFI from Asus. The M13H is the mainstay of the four first released models, the other three models are Gene, Extreme and Apex. as Maximus series of high-end products, both power supply, IO or cooling and RGB lighting can be described as luxury.

The Z590-E has a similar board shape to the M13H, except that it also has 4 x M.2 slots, the same WIFI chip and LAN chip, and a slightly lower configuration than the M13H. The Z590-A has a cartoon character attached to it in Asia, but in Europe and the US and ANZ it is much simpler, with 3 x M.2 slots but the WIFI chip is Intel AX200, which is not supported WIFI-6E specification, and the rest of the configuration is slightly lower than the Z590-E. It is important to mention that Asus has not compromised on the power supply of the mid-range motherboard, M13H, Z590-E and Z590-A all use 14+2+1 phases power; the LAN part is different in terms of the number of ports, and the chips also use 2.5Gb Intel I225-V.

So, let’s take a look at the details!

Product Specification

Asus ROG Maximus XIII Hero Tech Specs from Official Website
HERE

Package appearance
The whole package design of MAXIMUS XIII Hero is nearly the same as their previous version
Package Front

Opening the box
The accessories including the instruction guide, a greeting card, an ROG sticker, a driver CD, a key strip, RGB extension cable, fan/RGB expansion I/O cable, Wifi antenna etc

Product Analysis
The front and back look

The top I/O includes 2 x 8-pin CPU power socket with ProCool shields and a total of 7 fan headers, 1 x debug digitizer

The side I/O – In this area of the motherboard, we can find 2 x USB 3.2 Gen 1 headers, 6 x SATA3 ports, 1 x USB 3.2 Gen 2×2 socket, 24pin power socket, power&reset button and 2 x ARGB header

The rear I/O :
2 x Thunderbolt™ 4 USB Type-C® port(s)
6 x USB 3.2 Gen 2 port(s) (6 x Type-A)
2 x USB 2.0 port(s) (2 x Type-A)
1 x HDMI™ port
1 x ASUS Wi-Fi Module
2 x Intel® I225-V 2.5Gb Ethernet
5 x Gold-plated audio jacks
1 x Optical S/PDIF out port
1 x BIOS FlashBack™ button
1 x Clear CMOS button

The bottom I/O, includes HD audio header, 1 x RGB header, 1 x ARGB header, on-board retry button, 5 x fan headers including water flow and pump header, 1 x Water Out header, 2 x USB 2.0 headers and a Thermal Sensor header

This motherboard includes 4 x M.2 SSD slots, all M.2 slots are have bottom metal thermal conductor.
The M.2_1 port only supports PCIe Gen4 x4 mode by Intel’s 11th gen CPU, this slot will be disabled for other CPUs
The M.2_2 port supports PCIe Gen4 x4 under 11th gen CPU, PCI3 Gen3 x4 under 10th gen CPU
The M.2_3 port only supports PCIe Gen3 x4
The M.2_4 port supports both PCIe Gen3 x4 and SATA(shared with SATA3_5&6 ports)

The M.2 SSD full metal heat sinks

The rear IO shield VRM heatsink with ROG RGB logo

The new flip designed WIFI-6E antenna

Asus’ PCIe slot latches have been criticised by consumers for a long time, but Asus still insists on using them, not only changing the surface of the latch to the metal this time but also providing a metal push bar that is normally used as a holder of the graphics card. When the card needs to be pulled out, it can be used as a lever to push the latch to free the card. We don’t know if Asus will warranty this motherboard if we accidentally slip with this tool and poke off the component next to it

The main processor power controller chip is the Intersil ISL69269, it adopts a 14+2+1-phase, three-way CPU core power supply. The distribution on the motherboard is 7 parallel 14-phase CPU core + 2-phase integrated graphics + 1-phase Vccsa, the “Dr.Mos” chip is 95410RRB from Texas Instruments, single-phase 90A maximum current and total of 1440A

The ASUS SupremeFX supported sound card is ALC4082 from Realtek with ESS Sabre 9018Q2C DAC/AMP, it also uses the famous golden capacitors from Nichicon

The LGA 1200 slot of Intel’s 10/11th gen Core desktop processor

——————————————————-

Product Specification

Asus ROG Z590-E Tech Specs from Official Website
HERE

Package appearance
The whole package design of Z590-E is nearly the same as their previous version, the box has some more ROG design elements and the colour scheme is more like the effect of RGB lighting turned on
Package Front

Opening the box
The accessories are identical to M13H, including the instruction guide, a greeting card, a ROG sticker, a driver CD, a key strip, RGB extension cable, fan/RGB expansion I/O cable, Wifi antenna and the VRM cooling kit etc

Product Analysis
The front and back look

The top I/O includes 1×8-pin(with ProCool shields) + 1×4-pin CPU power socket, 3 x fan headers, RGB & ARGB socket and CPU OV header

The side I/O – In this area of the motherboard, we can find 2 x fan header, 6 x SATA3 ports, a USB 3.2 Gen 1 header, a USB 3.2 Gen 2×2 socket, 24pin power socket and debug digitiser

The rear I/O :
1 x USB 3.2 Gen 2×2 port (1 x USB Type-C®)
3 x USB 3.2 Gen 2 port(s) (2 x Type-A, 1 x USB Type-C® )
4 x USB 3.2 Gen 1 port(s) (4 x Type-A)
2 x USB 2.0 port(s) (2 x Type-A)
1 x HDMI™ port
1 x DisplayPort
1 x Intel® Wi-Fi 6E
2 x Intel® I225-V 2.5Gb Ethernet
5 x Gold-plated audio jacks
1 x Optical S/PDIF out port
1 x BIOS FlashBack™ button
1 x Clear CMOS button

The bottom I/O, includes HD audio header, 2 x ARGB headers, a Thunderbolt 4 header, 2 x USB 2.0 headers and a pump header

This motherboard includes 4 x M.2 SSD slots
The M.2_1 port only supports PCIe Gen4 x4 mode by Intel’s 11th gen CPU, this slot will be disabled for other CPUs
The M.2_2 port supports PCIe Gen4 x4 under 11th gen CPU, PCI3 Gen3 x4 under 10th gen CPU
The M.2_3 port only supports PCIe Gen3 x4
The M.2_4 port supports both PCIe Gen3 x4 and SATA(shared with SATA3_5&6 ports)
It is worth noting that only the M.2_1 slot offers the same thermally conductive metal base plate as the M13H

The M.2 SSD full metal heat sinks

The rear IO shield VRM heatsink with ROG RGB logo

The main processor power controller chip is the Intersil ISL69269, it adopts a 14+2+1-phase, three-way CPU core power supply. The distribution on the motherboard is 7 parallel 14-phase CPU core + 2-phase integrated graphics + 1-phase Vccsa, the “Dr.Mos” chip is 95410RRB from Texas Instruments, single-phase 90A maximum current and total of 1440A

The ASUS SupremeFX supported sound card is ALC4080 from Realtek with Savitech SV3H712 AMP, it also uses the famous golden capacitors from Nichicon

The LGA 1200 slot of Intel’s 10/11th gen Core desktop processor

——————————————————-

Product Specification

Asus ROG Z590-A Tech Specs from Official Website
HERE

Package appearance
The whole package design of Z590-A is nearly the same as their previous version, the I/O cover has been unified into a glitch design and the RGB part has been moved to the upper part
Package Front

Opening the box
The accessories are not as extensive as the previous two models, the graphics card holder, cooling kit and key string are not included

The originally designed WIFI antenna

Product Analysis
The front and back look

The top I/O includes 1×8-pin(with ProCool shields) + 1×4-pin CPU power socket, 4 x fan headers, an RGB header and a CPU OV header

The side I/O – In this area of the motherboard, we can find 6 x SATA3 ports, a USB 3.2 Gen 1 header, a USB 3.2 Gen 1 type-c socket, 24pin power socket and an ARGB header

The rear I/O :
1 x USB 3.2 Gen 2×2 port(s) (1 x USB Type-C®)
4 x USB 3.2 Gen 2 port(s) (4 x Type-A)
5 x USB 2.0 port(s) (4 x Type-A, 1 x Audio USB Type-C®)
1 x HDMI™ port
1 x DisplayPort
1 x ASUS Wi-Fi Module
1 x Intel® I225-V 2.5Gb Ethernet
5 x Audio jacks
1 x BIOS FlashBack™ button

The bottom I/O, includes an HD audio header, a S/PDIF out header, 3 x fan headers, 2 x ARGB headers, a Thunderbolt 4 header, 2 x USB 2.0 headers and a Thermal Sensor header

This motherboard includes 4 x M.2 SSD slots
The M.2_1 port only supports PCIe Gen4 x4 mode by Intel’s 11th gen CPU, this slot will be disabled for other CPUs
The M.2_2 and M.2_3 port supports both PCIe Gen3 x4 and SATA(shared with SATA3_2&6 ports)
It is worth noting that only the M.2_1 slot offers the same thermally conductive metal base plate as the M13H

The M.2 SSD full metal heat sinks

The rear IO shield VRM heatsink with ROG RGB logo

The main processor power controller chip is the Intersil ISL69269, it adopts a 14+2+1-phase, three-way CPU core power supply. The distribution on the motherboard is 7 parallel 14-phase CPU core + 2-phase integrated graphics + 1-phase Vccsa, the “Dr.Mos” chip is 95410RRB from Texas Instruments, single-phase 90A maximum current and total of 1440A

The ASUS SupremeFX supported sound card is ALC4080 from Realtek with Savitech SV3H712 AMP, it also uses the famous golden capacitors from Nichicon

The LGA 1200 slot of Intel’s 10/11th gen Core desktop processor

Overall
Overall, compared to the previous generation Z490 motherboard, the Z590 has significant upgrades in many areas such as power supply, memory compatibility and OC cap to unleash the maximum potential of the 11th and 10th generation Cores. The enhanced power supply also further strengthens the overall thermal environment of the motherboard with full coverage metal armour, including multiple sets of oversized heatsink fins, aluminium I/O armour with built-in heat pipes and high-quality thermal paste for significantly lower temperatures and better performance. This is definitely the perfect motherboard series for gamers and enthusiasts at the moment.

Spec-wise, the speed bonus that Thunderbolt 4 brings as a standard for the high-end Maximus series is a qualitative leap forward, knowing that the Thunderbolt interface used to be a standard for Apple, standing for high speed and stability. Now PC users can also enjoy the convenience and efficiency of this technology. And with PCIe Gen4 support comes higher speed M.2 SSD drives and increased graphics card bandwidth. For gamers, Asus has not only upgraded the LAN card to 2.5Gb, but WIFI 6/6E is also integrated as standard on the Z390-A and F models which were not previously equipped with WIFI, with WIFI 6E on the high-end model and WIFI 6 on the mid-range model. the sound card has been upgraded to SupremeFX ALC 4080/4082, with Savitech SV3H712 AMP or ESS ES9018Q2C DAC, taking gaming sound to a higher level and providing gamers with an immersive gaming experience.

The exterior lighting is unified with the Glitch logo design on these motherboards, reflecting the strong Cyberpunk style, with Aura sync for light linkage with other devices.

Technically, thanks to the new AI2.0 boost, it is very simple for users to overclock, temperature control, network and noise optimisation, saving a lot of time by eliminating the hassle of slow tweaking.

In terms of price, the entire Z590 series is on the higher side than the previous generation. After all, a large number of new features and the time saved by the simplified operation still needs to be paid for by the users themselves, after all, you get what you pay for.

EPIC REWARD: DESIGN AWARD, EPIC RECOMMENDED AWARD

Samsung 980 PRO Specifications
When people discuss the PRO series of Samsung SSDs, they don’t hesitate to give their praise. The predecessor, the 970 PRO, has also been at the top of the performance pile for a long time with its in-house Phoenix controller plus the premium MLC NANDs.

But the pace of electronic product updates is always so fast, with MLC NANDs gradually being phased out in favour of more technically mature TLC NANDs with higher storage density. Even enterprise SSDs seeking stability is gradually using TLC NANDs, with the more cost-effective TLC NANDs becoming the common type of NANDs used in consumer SSDs, and with PCIe 4.0 being introduced along with AMD’s new platform, SSD sequential read and write speeds are no longer limited to the perceived 3.5GB/s. To continue to consolidate its position, Samsung’s PRO series SSDs need to come up with new products to respond to the market and consumers.

Samsung did not rush into the war when the first generation of PCIe Gen4 SSDs was first released, but let manufacturers such as Adata, Corsair and Galax test the water first, and then officially entered the market when the Main Controller was really mature. Western Digital, a veteran hard drive manufacturer, has also followed the second-generation PCIe Gen4 SSD arms race with Sandisk’s mastering and flash chips. We’re testing the latest versions of the 980Pro 500GB and SN850 500GB from these two manufacturers today.

The main colour of the packaging is still black, with white text and the red colour characteristic of the PRO series, and the theoretical read speed peak is marked in the bottom right corner as a selling point to attract users

The SSD main body
The 980 PRO’s NVMe standard has been upgraded from 1.3 to 1.3c. Due to the interface upgrade, the 980 PRO’s read performance is far better than that of the 970 EVO Plus and 970 PRO. The smallest SLC Cache capacity is 4GB like the 970 EVO Plus, but the maximum capacity has been increased to 94GB, and due to the SLC Cache Thanks to the SLC Cache, the 5000 MB/s write speed is much faster than the 3200 MB/s of the 970 Evo Plus. Of course, the TLC is only 1000 MB/s raw write speed after the cache is exhausted, which is also faster than the 900 MB/s of the 970 Evo Plus.

What’s unusual is that we notice this copper foil cooling label on the back of the SSD. The actual value of an M.2 SSD is its compact size, and to put a large thermal waistcoat on a slim drive would defeat its thinness and lightness. The copper foil cooling label used on the 980 PRO and the nickel coating on the master provide good heat dissipation for the NANDs and the Controller chip, and with Samsung’s DTG technology, it is even more stable in harsher usage environments. It is also well compatible with the space of the mainframe or laptop without the use of a bulky cooling waistcoat, and will not fail to fit

The 980 PRO is powered by ‘Elpis’ controller — Samsung’s first ARM-based 8nm next-generation host chip, which is capable of handling up to four times the data volume of the previous generation ‘Phoenix’ controller when actually processing command sets. 980 PRO also uses Intelligent TurboWrite caching technology, which enables a larger dynamic cache size

DRAM cache model K4F4E3S4HF-BGCH, 512MB LPDDR4

The 980 PRO is powered by Samsung’s latest 6th generation V-NAND flash NANDs, which cost less and are naturally priced lower than the 970 PRO. It has 6900MB/s read speed and 5000MB/s write speed, with random read and write speeds of 1 million IOPS, which is more than 10% faster than the previous generation

Benchmarks
The Benchmark platform details:
CPU | AMD Ryzen 5950X
MTB | ASUS ROG Crosshair VIII Dark Hero
RAM | G-Skill Trident Z RGB 32G (2 x 16G) 4000 C16
SSD | Samsung 980 Pro 1TB | Samsung 980 Pro 500GB
VGA | ASUS TUF RTX 3080 OC
COL | AMD Wraith Prism

In TxBench tests, the performance is almost impeccable in all areas. Sequential read speeds near the peak of the interface transfer speeds, significantly upgraded random 4K read and write capabilities, and a larger cache space than other SSDs

The biggest change from MLC to TLC flash is actually its endurance, with the warranty writes dropping to 300 TBW, although according to Samsung’s official statistics, less than 1% of users will write more than 156 TB over a five-year period. So the 980 PRO’s endurance is perfectly adequate for a consumer SSD.

WD_BLACK SN850 Specifications
It has to be said that Western Digital has caught up early with the 2nd generation PCIe Gen4 SSDs. As a veteran SSD manufacturer, the SN850 is a flagship product after the previous launch of the popular SN750 SSD, and the SN850 is worthy of being the most powerful PCIe 4.0 SSD available, in terms of sustained read and write speeds, dynamic cache and acceptable temperature at full load.

The SN850 500GB is powered by Sandisk 20-82-10035-A1 controller and 2 x 256G Sandisk NAND flash chips

Like its previous SN750 model, the SN850 is also available in a cool black finish, demonstrating its orientation towards enthusiast-level gamers

The SN850 uses SanDisk’s 20-82-10035-A1 controller chip

The NAND chips are from SanDisk and two 256GB chips and a total of 500GB

The cache chip uses Nanya’s 256MB NT5AD256M16D4

Benchmarks
The Benchmark platform details:
CPU | AMD Ryzen 5950X
MTB | ASUS ROG Crosshair VIII Dark Hero
RAM | G-Skill Trident Z RGB 32G (2 x 16G) 4000 C16
SSD | WD_BLACK SN850 500GB
VGA | ASUS TUF RTX 3080 OC
COL | AMD Wraith Prism

In various TxBench tests, the performance is quite good in all aspects, especially 4K read and write, which has an overwhelming advantage over Samsung

Besides, the 1TB version of the SN850 is even more powerful, with slightly better read/write and 4K random read/write than the 980 Pro, offering better value for money

Summary
Through the above tests, we found that at the 500GB capacity level, the WD_BLACK SN850 is considerably better than the Samsung 980 Pro in terms of 4K random performance, but reading and writing is still no match for the 980 Pro. We also see that both the SN850 and 980 Pro represent the pinnacle of SSD manufacturing today and are perfectly capable of meeting the demanding needs of enthusiasts. However, in terms of price, both the 500GB 980 Pro and SN850 come in at around AU$225, which is very affordable.

EPIC PC RATE SCORE: Samsung 980 Pro 500GB 87/100

EPIC PC RATE SCORE: WD_BLACK SN850 500GB 87/100

EPIC AWARD: EPIC RECOMMENDED, EXTREME POWER，BEST VALUE

Samsung 980 Pro OFFICIAL WEBSITE: HERE
WD_BLACK SN850 OFFICIAL WEBSITE: HERE

AMD’s turnaround: 3rd generation Ryzen 3900X with a main cache of 70MB, and a TDP of only 105W. The new generation CPU’s are packaged almost identical to the previous generation, with a combination of silver and orange, but replaced with a cardboard box, printed with scaly texture.

CPU Package Appearance

The outside packaging

The CPU package uses a semi-open design, with a transparent window like the Intel’s design

The internal package, adorned with the ‘Built To Perform, Designed to win’ slogan

The box contains the CPU, the special designed new generation Ryzen sticker and the Wraith Prism CPU cooling heatsink

The main CPU is not particularly different in appearance from the previous generation Ryzen CPU’s, but the internal structure design is completely different

In terms of heat dissipation, AMD is still quite ahead compared to Intel, Intel opting for a very basic heatsink. The Ryzen chip comes with its own RGB Wraith Prism heatsink, which is no different from the previous generation of radiators

The motherboard that we are using for our tests will be the ROG Strix X570-F from ASUS. The packaging still continues to use the previous generation Strix colour and pattern.

Motherboard Package Appearance

The attachment contains driver CD, new designed ROG sticker, do not disturb notice door sign, an instruction manual and a greeting card

The new version of the motherboard sticker and the do-not-disturb door sign are adopt the matrix dot pattern

It also contains 4 SATA cables (in the same package), an M.2 SSD screw pack, a cable tie pack, an RGB extension cable, and a thermal monitoring sensor cable

The motherboard has the same colour design as the previous generation. No wireless and Bluetooth modules are included

This motherboard uses 12+2 phases and 4+8pin input. The power chip uses ASUS’s own Digi+EPU ASP1106GGQW. The ASP1106 controller supports up to four Vcore phases And two SC phases. In order to meet the current requirements of the latest Ryzen 3000 processor, Asus has installed three power stages for each Vcore stage. With 14 pieces of SiC639. These 50 A power stages provide 150 A current per Vcore phase for ASUS. Although the result is far less complex than the real 14 phases, the power output does exist.

For I/O, the F series does not include a Wifi card. The interface provides four USB 3.2 Gen1 and four USB 3.2 Gen2 (including a Type-C). Unfortunately, the network cable interface is not 5Gbps

Compared with the Intel platform, the 3rd generation Ryzen has certain advantages on supporting PCIe buses. The CPU has a total of 24 PCIe Gen4 channels and 4 channels for chipset communication. It is specially designed for high-speed storage, and the speed is twice as fast compared to previous PCIe Gen3, and the remaining 20 channels are used to support graphics cards or SSDs. The 3rd generation Ryzen CPU natively supports 4 x USB 3.2 Gen2 ultra-fast 10Gbps connections

The Northbridge controller is manufactured in a 14nm process and has a PCIe Gen4 controller built-in. The PCIe controller from the X570 is all Gen4. The only disadvantage is that the temperature is really high

In terms of the memory compatibility, the X570 chipset has enhanced the memory compatibility, and the problem of ‘dedicated memory’ that was criticised by the previous generation has been alleviated

The SSD used in this test is the PCIe Gen4 version CORSAIR MP600

There is a metal backplate on the bottom of the heat sink, which will conflict with the rubber pads on the motherboard that prevent SSD bending

The upper part of the self-contained heat sink of SSD is too large, and it is not compatible with the heat-dissipating armour of the motherboard, and it must be removed

We installed the SSD on the M.2-2 slot. The north bridge’s cooling fan will make the SSD have better ventilation

The power supply we are using is a platinum series power supply from Seasonic to ensure a stable power provides

The heat sink that we used is a 240 AIO water-cooling kit and the AMD Wraith Prism air-cooled heatsink

Our testing bench

ROG motherboard and the sexy Wraith Prism cooler with RGB SYNC

BIOS snapshots

In the parameter comparison section, we used the Intel i9 9900K and the ASUS ROG Maximus XI Z390 platform.

In the system part, we have adopted Win10 1903 in a unified way. This version has optimised the 3rd generation Ryzen to a certain extent, and single-core gaming will have better performance.

In the driver part, after installing the latest AMD companion chipset driver, it will provide the Gen3 Ryzen exclusive UEFI Collaborative Power and Performance Control, which will speed up the CPU Turbo response time. When the load occurs, the CPU frequency increases. The reaction time will be reduced from 30ms to 1ms in the previous generation, and the speed of web browsing and software opening will be significantly improved. At the same time, we will switch the power management plan provided by AMD to High Performance and turn off the automatic overclocking.

Benchmarks

In the beginning, the CPU-Z details

CPU-Z Cache details
Level 3 cache is 4 x 16MB

CPU-Z Ram details
The memory frequency we use on the AMD platform will be lower than 3600MHz, mainly because the 3rd generation Ryzen separates the bus from the memory controller, and the FCLK frequency will be consistent with the DRAM frequency. The memory delay in this state will be minimised. With a large-capacity level 3 cache, the gaming performance will be further enhanced. When the memory frequency is greater than 3600Mhz, the BIOS will automatically divide the FCLK frequency and cut it to half. At this time, the memory delay will increase greatly, and the actual performance will decrease

CPU-Z Benchmark, compare with 9900K’s reference, single core speed, just 1% slower, but dominated the 9900K in multicore

Cinebench R15 single-core result

Cinebench R15 multi-core result

Cinebench R15 Extreme multi-core result

Cinebench R20 single-core result

Cinebench R20 multi-core result

The 3rd generation Ryzen loses out slightly to the i7 9900K in the single-core benchmark, and on multi-core, it has a strong performance, crushing the 9900K. In the multi-thread optimised 3D rendering VRAY test, the 3900X with a multi-core advantage is nearly 20s faster than 9900K.

In 3DMARK’s multiple tests, the CPU physical score of the 3900X is about 6% better than 9900K in Time Spy Extreme, and about 20% better than 9900K in Fire Strike Extreme, compared with the previous generation Thread Ripper 2950X, it also has a 10% Improvement.

Compared with SPECviewperf which pays attention to test graphics card, SPECworkstation3 is quite complete for CPU performance either. The following test is the comparison between Intel and AMD platform

Gaming test

Most games such as Assassin Creed: Odyssey which support AVX instruction set have slightly better performances on Intel than the AMD platform. However, the test results reflect the 3rd gen Ryzen has very close performance in game performance. We are witnessing massive leaps from AMD in this regard.

Heat test
we tested the CPU temperature when under full load by using AIDA64, the average temperature of the 9900K is around 75°C, 3900X is around 60°C. Under the FPU burning test, 9900K is around 104°C due to the AVX instruction set, and 3900X is around 87°C.

Power usage test
We tested the whole computer power consumption when under full load by using AIDA64, the average power consumption of the 9900K bench machine is around 240W/h, 3900X bench machine is around 175W/h. However, the single FPU burning test result is unexpected for us, 9900K generated huge power consumption due to the AVX instruction set, which is around 400W/h, and 3900X is only using around 250W/h.

Overclocking
This 3rd generation Ryzen comes with automatic overclocking settings. According to the official statement, this CPU can be stable OC about 200MHz, but in fact, we can only pull up about 80Mhz, and because the CPU default voltage is initially high that leads to manual overclocking becoming extremely difficult. Even the Ryzen Master offers a voltage limit of 1.535V, and we have not successfully increased the core frequency to 4.5Ghz at this voltage.

Summary
The performance of this AMD X570 platform is really conspicuous. ASUS’s top-level material support and the strong performance of the 3900X have shown a beautiful turnaround from an otherwise Intel dominated landscape.

In terms of price, although the price of 3900X in Australia is slightly higher than 9900K around $30, and the single-core frequency is slightly lower than 9900K, but the number of cores is 4 more, and the number of threads is 8 more. It also has a large level 3 cache and using 7nm TSMC’s new technology to greatly reduce heat and power consumption. Plus, the PCIe Gen4 support and increased memory compatibility.

This time, AMD’s sales strategy is undoubtedly successful. The powerful performance takes into account gameplay and at the same time, it provides a very stable environment and high-speed use for technicians or enthusiasts who work at home and need to do film editing, modeling, rendering, and graphic design.

However, AMD’s old rival Intel remained silent and we will have to wait and see their next move.

EPIC PC RATE SCORE: CPU 87/100

EPIC REWARD: EPIC RECOMMENDED, EDITOR’S CHOICE & EXTREME POWER

EPIC PC RATE SCORE: MOTHERBOARD 87/100

EPIC REWARD: EPIC RECOMMENDED & EDITOR’S CHOICE

EPIC PC RATE SCORE: PCIe GEN4 SSD 94/100

EPIC REWARD: EPIC RECOMMENDED & EXTREME POWER

ASUS X570-F OFFICIAL WEBSITE: HERE

AMD Ryzen 9 3900X OFFICIAL WEBSITE: HERE

CORSAIR 600P PCIe Gen4 SSD OFFICE WEBSITE: HERE